Flexible Copper Clad Laminate, also known as Flexible Copper Clad Laminate, Flexible Copper Clad Laminate, Flexible Printed Circuit Board (FPC) is the processing base material of Flexible Printed Circuit Board (FPC).

Characteristic

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In addition to the advantages of thin, light and flexible, FCCL with polyimide-based membranes also has excellent electrical, thermal and thermal properties. Its low dielectric constant (Dk) makes the electrical signal transmit quickly. Good thermal performance can make components easy to cool down. Higher glass transition temperature (Tg) can make the components work well at higher temperatures. Because most of the products of FCCL are provided to users in continuous roll form, the production of printed circuit boards using FCCL is conducive to the automatic continuous production of FPC and the continuous surface installation of components on FPC. [1]

classification

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Flexible copper foil substrates (FCCL) can be divided into two categories: traditional three-layer flexible plate substrates (3L FCCL) with follow-up agent and new two-layer flexible plate substrates (2L FCCL) without follow-up agent. The flexible copper clad laminate is composed of flexible insulating base film and metal foil. It is composed of three different materials: copper foil, thin film and adhesives. The flexible copper clad laminate is called three-layer flexible copper clad laminate (3L-FCCL). Flexible copper clad laminates without adhesives are called two-layer flexible copper clad laminates (2L-FCCL). Because the manufacturing methods of these two kinds of soft copper foil substrates are different, the material characteristics of these two kinds of substrates are also different. In application, the two types of FCCL application products are different. 3L-FCCL is used in large-scale software products, while 2L FCCL is used in higher-level software manufacturing, such as hard and soft board, COF, etc. Because 2L FCCL is expensive and its output is not enough to supply the demand of high-level software board, many domestic and foreign manufacturers have invested in 2L FCCL production. But there are still some problems, such as slow output speed and low yield. [1]

Flexible copper clad laminate

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Product Composition

The composition of flexible copper clad laminates mainly includes three kinds of materials: insulating basement membrane materials: insulating basement membrane materials for flexible copper clad laminates include polyester (PET) film, polyimide (PI) film, polyesterimide film, fluorocarbon ethylene film, imide fiber paper, polybutylene paraphthalate film and so on. Among them, the most widely used are polyester film (PET film) and polyimide film (PI film).

Metal conductor foil

Metal conductor foil is a kind of conductor material for flexible copper clad laminates. It includes copper foil (common electrolytic copper foil, high ductility electrolytic copper foil, calendered copper foil), aluminum foil and copper-beryllium alloy foil. Most of them are copper foil, including electrolytic copper foil (ED) and calendered copper foil (RA).

An adhesive

Adhesive is an important component of three-layer flexible copper clad laminate, which directly affects the product performance and quality of flexible copper clad laminate. The main adhesives for flexible copper clad laminates are polyester adhesives, acrylic adhesives, epoxy or modified epoxy adhesives, polyimide adhesives and phenolic-butyral adhesives. In the three-layer flexible copper clad laminate industry, adhesives are mainly divided into acrylic adhesives and epoxy adhesives.

classification

DuPont single-sided FCCL.

One-sided three-layer flexible copper clad laminate products (DuPont, size 0.6 x 0.9m).

Double-sided three-layer flexible copper clad laminate products (DuPont, size 0.6 x 0.9m).

Common varieties

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It includes: PI coating, PET coating, polyester coating, polyimide coating, acrylic coating, epoxy resin coating, one-sided copper foil substrate, double-sided copper foil substrate, electrolytic copper foil substrate, calendered copper foil substrate, PI film substrate, PET film substrate, PVC film substrate, PEN film substrate. Material, polyimide copper foil base material, polyester copper foil base material, polyvinyl chloride copper foil base material, polytetrafluoroethylene copper foil base material, non-adhesive copper foil base material, double-sided copper foil non-adhesive base material, single-sided copper foil non-adhesive base material, acrylic pure film, epoxy resin pure film.

The commonly used thickness of the film is 25, 30, 35, 36, 38, 40, 42, 50, 60, 75, 80, 100, 115, 120, 125, 160 and 320 microns.

The commonly used widths of coatings are 120 mm, 130 mm, 150 mm, 250 mm, 260 mm, 270 mm, 280 mm, 300 mm, 304 mm, 305 mm, 310 mm, 330 mm, 450 mm, 500 mm, 510 mm, 550 mm, 600 mm, 610 mm, 630 mm, 750 mm, 800 mm, 810 mm, 1220 mm, 1300 mm.

Common length of covering film: 250 mm, 300 mm, 305 mm, 420 mm, 450 mm, 500 mm, 600 mm, 610 mm, 630 mm, 750 mm, 800 mm, 810 mm, 1220 mm, 1300 mm, 25M, 27.4M, 50M, 100M, 600M, 1000M.

Commonly used thickness of copper foil substrate:

The main suppliers of copper foil base materials are Nippon Steel, Nippon Mektron, Arisawa, Toray, Mitsui Chemical, Nitto Denko, 3M, Dupont Taiju, Taihong, Changjie, Lusheng, Xinyang, etc.

Status of supply

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The global FCCL market and supplier has a market value of 1.25 billion US dollars in 2002 and a size of 1.42 billion US dollars in 2003. It is estimated that the global FCCL market will still be growing in 2004, and the global FCCL market is expected to reach 1.67 billion US dollars in Taiwan's soft copper foil base under the situation that the supply of FCCL is still in short supply. The total output value of timber increased from NT$1.8 billion in 1998 to NT$3.02 billion in 2002. Under the influence of the opening of various production capacity, the output value in 2003 was revised from the original estimated 3.6 billion to 4.4 billion yuan, up to 4.45 billion yuan, accounting for the proportion of global FCCL.